Effect of aging on Sn-Bi lead-free solder

被引：0
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作者：
Li, Yuan-Shan [1 ]
Chen, Zhen-Hua [2 ]
Lei, Xiao-Juan [2 ]
机构：
[1] School of Computer, National University of Defense Technology, Changsha 410073, China
[2] School of Material Science and Engineering, Hunan University, Changsha 410082, China
来源：
Cailiao Kexue yu Gongyi/Material Science and Technology | 2009年 / 17卷 / 03期
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页码：339 / 342
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