Optical Interconnects Using Hybrid Integration of CMOS and Silicon-Photonic ICs

被引：1

作者：

Saxena, Vishal ^{[1
]}

Kumar, Ankur ^{[2
]}

Mishra, Shubham ^{[1
]}

Palermo, Samuel ^{[2
]}

Lakshmikumar, Kadaba R. ^{[3
]}

机构：

[1] Univ Delaware, ECE Dept, Newark, DE 19716 USA

[2] Texas A&M Univ Coll Stn, ECE Dept, College Stn, TX 77843 USA

[3] Cisco Syst, Silicon Photon Div, Allentown, PA 95134 USA

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | 2024年 / 71卷 / 03期

关键词：

Microring modulator; optical interconnects; photonic integrated circuit (PIC); pulse-amplitude modulation (PAM); silicon photonics; transimpedance amplifier (TIA); MICRORING MODULATOR; PAM-4; TRANSMITTER; DRIVER; TRANSCEIVER;

D O I：

10.1109/TCSII.2023.3333864

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon photonic-based optical interconnects have emerged as the enabler for the continual scaling of high-data transfer rates required for emerging computing applications. Transceivers employing multilevel modulation promise a pathway towards realizing the future Terabit Ethernet standards. This tutorial brief overviews SiP modulator devices, and circuit design techniques for hybrid CMOS-photonic transceivers focusing on compact microring modulator transmitters and inverter-based linear receivers in scaled CMOS technologies.

引用

页码：1632 / 1637

页数：6

共 50 条

[41] Cost-effective silicon-photonic biosensors using doped silicon detectors and a broadband source
Dias, Leanne
Shoman, Hossam
Luan, Enxiao
Jayatilleka, Hasitha
Shekhar, Sudip
Chrostowski, Lukas
Jaeger, Nicolas A. F.
OPTICS EXPRESS, 2023, 31 (06) : 9135 - 9145
[42] LoCI: An Analysis of the Impact of Optical Loss and Crosstalk Noise in Integrated Silicon-Photonic Neural Networks
Shafiee, Amin
Banerjee, Sanmitra
Chakrabarty, Krishnendu
Pasricha, Sudeep
Nikdast, Mahdi
PROCEEDINGS OF THE 32ND GREAT LAKES SYMPOSIUM ON VLSI 2022, GLSVLSI 2022, 2022, : 351 - 355
[43] Monolithic Integration of InP Based Structures on Silicon for Optical Interconnects
Kataria, H.
Metaferia, W.
Junesand, C.
Sun, Y. T.
Loududoss, S.
SIGE, GE, AND RELATED COMPOUNDS 6: MATERIALS, PROCESSING, AND DEVICES, 2014, 64 (06): : 523 - 531
[44] Fast Optical Circuit Switch Using Monolithically Integrated Silicon-Photonic Space Switch and Wavelength-Tuneable Filter
Mori, Yojiro
Ganbold, Mungun-Erdene
Shiraki, Ryuta
Suzuki, Keijiro
Matsuura, Hiroyuki
Kawashima, Hitoshi
Namiki, Shu
Ikeda, Kazuhiro
Sato, Ken-ichi
2018 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC), 2018,
[45] Silicon on Insulator optical modulators for integration in Photonic Optical Circuits
Reed, G. T.
Thomson, D. J.
Gardes, F. Y.
Mashanovich, G. Z.
Hu, Y.
Ke, L.
Wilson, P. W.
Zimmermann, L.
Knoll, D.
Lischke, S.
Porte, H.
Goll, B.
Zimmermann, H.
Chen, S-W.
Hsu, S. H.
Fedeli, J-M.
Debnath, K.
O'Faolain, L.
Krauss, T. F.
Aamer, M.
Brimont, A.
Sanchis, P.
Hakansson, A.
OPTICAL INTERCONNECTS XIV, 2014, 8991
[46] Hyperuniform disordered photonic band gap silicon devices for optical interconnects
Milosevic, Milan M.
Florescu, Marian
Man, Weining
Nahal, Geev
Tsitrin, Sam
Amoah, Timothy
Steinhardt, Paul J.
Torquato, Salvatore
Chaikin, Paul M.
Mullen, Ruth Ann
2014 IEEE OPTICAL INTERCONNECTS CONFERENCE, 2014, : 1 - 2
[47] Hybrid integration of carbon nanotubes in silicon photonic structures
Duran-Valdeiglesias, E.
Zhang, W.
Alonso-Ramos, C.
Le Roux, X.
Serna, S.
Hoang, H. C.
Marris-Morini, D.
Cassan, E.
Intonti, F.
Sarti, F.
Caselli, N.
La China, F.
Gurioli, M.
Balestrieri, M.
Filoramo, A.
Vivien, L.
SMART PHOTONIC AND OPTOELECTRONIC INTEGRATED CIRCUITS XIX, 2017, 10107
[48] Silicon Photonic devices and circuits based on hybrid integration
Liu, Liu
Chen, Pengxin
Ruan, Ziliang
Zhang, Xian
2019 ASIA COMMUNICATIONS AND PHOTONICS CONFERENCE (ACP), 2019,
[49] Hybrid material integration in silicon photonic integrated circuits
Chakravarty, Swapnajit
Teng, Min
Safian, Reza
Zhuang, Leimeng
JOURNAL OF SEMICONDUCTORS, 2021, 42 (04)
[50] Hybrid material integration in silicon photonic integrated circuits
Swapnajit Chakravarty
Min Teng
Reza Safian
Leimeng Zhuang
Journal of Semiconductors, 2021, 42 (04) : 37 - 46

← 1 2 3 4 5 →