Optical Interconnects Using Hybrid Integration of CMOS and Silicon-Photonic ICs

被引：1

作者：

Saxena, Vishal ^{[1
]}

Kumar, Ankur ^{[2
]}

Mishra, Shubham ^{[1
]}

Palermo, Samuel ^{[2
]}

Lakshmikumar, Kadaba R. ^{[3
]}

机构：

[1] Univ Delaware, ECE Dept, Newark, DE 19716 USA

[2] Texas A&M Univ Coll Stn, ECE Dept, College Stn, TX 77843 USA

[3] Cisco Syst, Silicon Photon Div, Allentown, PA 95134 USA

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | 2024年 / 71卷 / 03期

关键词：

Microring modulator; optical interconnects; photonic integrated circuit (PIC); pulse-amplitude modulation (PAM); silicon photonics; transimpedance amplifier (TIA); MICRORING MODULATOR; PAM-4; TRANSMITTER; DRIVER; TRANSCEIVER;

D O I：

10.1109/TCSII.2023.3333864

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon photonic-based optical interconnects have emerged as the enabler for the continual scaling of high-data transfer rates required for emerging computing applications. Transceivers employing multilevel modulation promise a pathway towards realizing the future Terabit Ethernet standards. This tutorial brief overviews SiP modulator devices, and circuit design techniques for hybrid CMOS-photonic transceivers focusing on compact microring modulator transmitters and inverter-based linear receivers in scaled CMOS technologies.

引用

页码：1632 / 1637

页数：6

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