INTERCONNECTS FOR SUBMICRON ASICS

被引：0
|
作者：
BARTELINK, DJ
CHIU, KY
机构：
来源：
1989 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS: PROCEEDINGS OF TECHNICAL PAPERS | 1989年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：59 / 62
页数：4
相关论文
共 50 条
  • [21] Electromigration in Al interconnects and the challenges in ultra-deep submicron technology
    Zhang Wen-Jie
    Yi Wan-Bing
    Wu Jin
    ACTA PHYSICA SINICA, 2006, 55 (10) : 5424 - 5434
  • [22] Estimation of Crosstalk Noise for RLC Interconnects in Deep Submicron VLSI Circuit
    Maniruzzaman, Md.
    Ahmed, Shakil
    Fattah, Galib Md.
    Toma, Rafia Nishat
    2ND INTERNATIONAL CONFERENCE ON ELECTRICAL ENGINEERING AND INFORMATION COMMUNICATION TECHNOLOGY (ICEEICT 2015), 2015,
  • [23] Modelling and layout optimization of VLSI devices and interconnects in deep submicron design
    Cong, J
    PROCEEDINGS OF THE ASP-DAC '97 - ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 1997, 1996, : 121 - 126
  • [24] Millimeter wave wireless interconnects in deep submicron chips: Challenges and opportunities
    Gade, Sri Harsha
    Ram, Shobha Sundar
    Deb, Sujay
    INTEGRATION-THE VLSI JOURNAL, 2019, 64 : 127 - 136
  • [25] A unified approach to detecting crosstalk faults of interconnects in deep submicron VLSI
    Li, KSM
    Lee, CL
    Su, CC
    Chen, JE
    13TH ASIAN TEST SYMPOSIUM, PROCEEDINGS, 2004, : 145 - 150
  • [26] Crystallographic study of electromigration failure sites in submicron Al(Cu) interconnects
    Chu, X
    Prybyla, JA
    Theiss, SK
    Marcus, MA
    APPLIED PHYSICS LETTERS, 1999, 75 (24) : 3790 - 3792
  • [27] ASICs, structured ASICs, and FPGAs
    Electron Des, 2006, 1 (36):
  • [28] Direct observation of the effects of Cu distribution on electromigration phenomena in submicron Al interconnects
    Theiss, SK
    Prybyla, JA
    POLYCRYSTALLINE THIN FILMS: STRUCTURE, TEXTURE, PROPERTIES, AND APPLICATIONS II, 1996, 403 : 651 - 656
  • [29] Stress evolution related to metal routing in submicron multilevel interconnects: Void and extrusion
    Jo, Yong-Bum
    Park, Jongwoo
    Park, June-Kyun
    Ouh, Kyung-Il
    Jeon, Hyun-Goo
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (04): : 724 - 730
  • [30] Electromigration in submicron dual-damascene Cu/low-k interconnects
    Lee, KD
    Lu, X
    Ogawa, ET
    Matsuhashi, H
    Blaschke, VA
    Augur, R
    Ho, PS
    SILICON MATERIALS-PROCESSING, CHARACTERIZATION AND RELIABILITY, 2002, 716 : 599 - 605
12345