HOW TO OPTIMIZE AND CONTROL THE WIRE BONDING PROCESS .2.

被引：0
|
作者：
SHEAFFER, M
LEVINE, L
机构：
来源：
SOLID STATE TECHNOLOGY | 1991年 / 34卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To help process engineers improve, optimize, and control the wire bonding process, proven statistical analysis tools/techniques are provided to deal with four stages of a process. Part I (SST, November 1990) covered development of a new process. Part II will discuss a process running at low yield, improving a marginally acceptable process, and maintaining process quality.
引用
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页码：67 / 70
页数：4
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