共 50 条
- [1] Parameter sensitivity analysis for force control in gold wire bonding process PROCEEDINGS OF THE SIXTH INTERNATIONAL CONFERENCE ON FLUID POWER TRANSMISSION AND CONTROL, 2005, : 748 - 753
- [2] Bonding mechanism in gold wire crescent bonding JOINING OF ADVANCED AND SPECIALTY MATERIALS VI, 2004, : 150 - 158
- [5] Comparing the copper and gold wire bonding during thermalsonic wire bonding process 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 240 - 243
- [6] The process control technique for gold wire bonding of multichip modules PROCEEDINGS OF THE 3RD CHINA-JAPAN SYMPOSIUM ON MECHATRONICS, 2002, : 306 - 310