Thermodynamic aspect of the wire-bonding process

被引：0
|
作者：
Falk, J. [1 ]
机构：
[1] Degussa AG, Rheinfelden, Germany
来源：
Microelectronics International | 1998年 / 15卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：23 / 31
相关论文
共 50 条
  • [1] Wire-bonding assembly
    Won, Rachel
    NATURE PHOTONICS, 2018, 12 (09) : 500 - 500
  • [2] Wire-bonding assembly
    Rachel Won
    Nature Photonics, 2018, 12 : 500 - 500
  • [3] Wire-bonding process development for low-k materials
    Tan, J
    Zhong, ZW
    Ho, HM
    MICROELECTRONIC ENGINEERING, 2005, 81 (01) : 75 - 82
  • [4] Wire-bonding process monitoring using thermopile temperature sensor
    Suman, S
    Gaitan, M
    Joshi, Y
    Harman, GG
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 685 - 693
  • [5] Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding
    Aoh, JN
    Chuang, CL
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 300 - 311
  • [6] Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding
    Jong-Ning Aoh
    Cheng-Li Chuang
    Journal of Electronic Materials, 2004, 33 : 300 - 311
  • [7] Wire-bonding on printed circuit boards
    Falk, J.
    Hauke, J.
    Kyska, G.
    Circuit World, 1994, 20 (02) : 8 - 13
  • [8] OPTIMIZING THE WIRE-BONDING PROCESS FOR COPPER BALL BONDING, USING CLASSIC EXPERIMENTAL-DESIGNS
    SHEAFFER, M
    LEVINE, LR
    SCHLAIN, B
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (03): : 321 - 326
  • [9] OPTIMIZING THE WIRE-BONDING PROCESS FOR COPPER BALL BONDING, USING CLASSIC EXPERIMENTAL DESIGNS.
    Sheaffer, Michael
    Levine, Lee R.
    Schlain, Brian
    IEEE transactions on components, hybrids, and manufacturing technology, 1986, CHMT-10 (03): : 321 - 326
  • [10] Vibration Characteristics of a Wire-Bonding Ultrasonic Horn
    Kim, Young Woo
    Yim, Vit
    Han, Daewoong
    Lee, Seung-Yop
    TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, 2014, 38 (02) : 227 - 233
12345