A 4-MB LOW-TEMPERATURE DRAM

被引:14
|
作者
HENKELS, WH
WEN, DS
MOHLER, RL
FRANCH, RL
BUCELOT, TJ
LONG, CW
BRACCHITTA, JA
COTE, WJ
BRONNER, GB
机构
[1] IBM CORP,CTR ADV SEMICOND TECHNOL,HOPEWELL JUNCTION,NY 12533
[2] IBM CORP,DIV GEN TECHNOL,ESSEX JUNCTION,VT 05402
关键词
D O I
10.1109/4.98967
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the characterization of the first DRAM fabricated in a technology specifically optimized for cryogenic operation. With the power supply adjusted to assure hot-electron reliability, the 25-ns 4-Mb low-temperature (LT) chips operated 3 x faster than conventional chips. The LT-optimized chips functioned properly with cycle times as fast as 45 ns, and with a toggle-mode data rate of 667 Mb/s. Wide operating margins and a very large process window for data retention were demonstrated; at a temperature of 85 K the storage retention time of the trench-capacitor memory cells exceeded 8 h. This work shows that the performance leverage offered by low temperature applies equally well to DRAM as it does to logic; there is no limitation inherent to memory.
引用
收藏
页码:1519 / 1529
页数:11
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