FABRICATION OF MICROELECTRONICS RETICLES

被引：0
|
作者：
SHOHO, RM
机构：
来源：
SOLID STATE TECHNOLOGY | 1979年 / 22卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：75 / 79
页数：5
相关论文
共 50 条
  • [31] Modeling of a silane LPCVD process used for microelectronics and MEMS fabrication
    Pawlowski, RP
    Salinger, AG
    Habermehl, SD
    Ho, P
    FUNDAMENTAL GAS-PHASE AND SURFACE CHEMISTRY OF VAPOR-PHASE DEPOSITION II AND PROCESS CONTROL, DIAGNOSTICS, AND MODELING IN SEMICONDUCTOR MANFACTURING IV, 2001, 2001 (13): : 276 - 283
  • [32] Electrostatic chucking of EUVL reticles
    Nataraju, Madhura
    Sohn, Jaewoong
    Mikkelson, Andrew R.
    Engelstad, Roxann L.
    Turner, Kevin T.
    Van Peski, Chris K.
    Orvek, Kevin J.
    EMERGING LITHOGRAPHIC TECHNOLOGIES XI, PTS 1 AND 2, 2007, 6517
  • [33] Exposing freshman to microelectronics fabrication as part of an innovative materials science course
    Palmer, MA
    Pearson, RE
    Atkinson, GM
    FOURTEENTH BIENNIAL UNIVERSITY/GOVERNMENT/INDUSTRY MICROELECTRONICS SYMPOSIUM, PROCEEDINGS, 2001, : 117 - 119
  • [34] Finite element modeling of temporary bonding systems for flexible microelectronics fabrication
    Haq, Jesmin
    Vogt, Bryan D.
    Raupp, Gregory B.
    Loy, Doug
    MICROELECTRONIC ENGINEERING, 2012, 94 : 18 - 25
  • [35] Fabrication of carbon nanotube/copper and carbon nanofiber/copper composites for microelectronics
    Ladani, Leila
    Awad, Ibrahim
    She, Ying
    Dardona, Sameh
    Schmidt, Wayde
    MATERIALS TODAY COMMUNICATIONS, 2017, 11 : 123 - 131
  • [36] Fabrication, integration and reliability of nanocomposite based embedded capacitors in microelectronics packaging
    Das, Rabindra N.
    Lauffer, John M.
    Markovich, Voya R.
    JOURNAL OF MATERIALS CHEMISTRY, 2008, 18 (05) : 537 - 544
  • [37] Front-to-back alignment techniques in microelectronics/MEMS fabrication: A review
    Pal, P
    Kim, YJ
    Chandra, S
    SENSOR LETTERS, 2006, 4 (01) : 1 - 10
  • [38] The canary reticle - A new diagnostic for reticles and a window into the physics of ESD damage to reticles
    Levit, L
    Englisch, A
    17TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICROCOMPONENTS, 2001, 4349 : 37 - 41
  • [39] Overlay accuracy of reticles
    Shirai, H
    Takeuchi, K
    Shigematsu, K
    OPTICAL MICROLITHOGRAPHY XI, 1998, 3334 : 649 - 657
  • [40] Inspection of EUV reticles
    Pettibone, D
    Veldman, A
    Liang, T
    Stivers, AR
    Mangat, P
    Lu, B
    Hector, S
    Wasson, J
    Blaedel, K
    Fisch, E
    Walker, DM
    EMERGING LITHOGRAPHIC TECHNOLOGIES VI, PTS 1 AND 2, 2002, 4688 : 363 - 374
12345