RING FORMATION OF KIRKENDALL VOIDS IN PB-ALLOY THIN-FILM DIFFUSION COUPLES

被引:4
|
作者
HUANG, HCW [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
关键词
D O I
10.1063/1.93674
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:724 / 726
页数:3
相关论文
共 50 条
  • [41] LOW-TEMPERATURE COMPOUND FORMATION IN CU/SN THIN-FILM COUPLES
    CHOPRA, R
    OHRING, M
    OSWALD, RS
    THIN SOLID FILMS, 1982, 94 (04) : 279 - 288
  • [42] KINETICS OF COMPOUND FORMATION IN THIN-FILM COUPLES OF AL AND TRANSITION-METALS
    HOWARD, JK
    LEVER, RF
    SMITH, PJ
    HO, PS
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01): : 68 - 71
  • [43] Interdiffusion, phase formation, and stress development in Cu-Pd thin-film diffusion couples: Interface thermodynamics and mechanisms
    Chakraborty, J.
    Welzel, U.
    Mittemeijer, E. J.
    JOURNAL OF APPLIED PHYSICS, 2008, 103 (11)
  • [44] THIN-FILM DIFFUSION BARRIERS
    NICOLET, MA
    JOURNAL OF METALS, 1979, 31 (08): : F22 - F23
  • [45] THIN-FILM DIFFUSION - REVIEW
    TURNER, PA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 262 - &
  • [46] FORMATION OF INTERMETALLICS AND GRAIN-BOUNDARY DIFFUSION IN CU-AL AND AU-AL THIN-FILM COUPLES
    VANDENBERG, JM
    DENBROEDER, FJA
    HAMM, RA
    THIN SOLID FILMS, 1982, 93 (3-4) : 277 - 280
  • [47] Interdiffusion, phase formation, and stress development in Cu-Pd thin-film diffusion couples: Interface thermodynamics and mechanisms
    Chakraborty, J.
    Welzel, U.
    Mittemeijer, E.J.
    Journal of Applied Physics, 2008, 103 (11):
  • [48] EVALUATION OF DIFFUSION PARAMETERS IN THIN-FILM DIFFUSION COUPLES BY MEANS OF KIESSIG X-RAY INTERFERENCES
    WAGENDRISTEL, A
    WOLF, D
    BANGERT, H
    THIN SOLID FILMS, 1976, 32 (02) : 307 - 310
  • [49] STRUCTURE OF GOLD TIN THIN-FILM COUPLES
    SHARMA, SK
    SINGH, MP
    MALHOTRA, GL
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1991, 128 (02): : 407 - 417
  • [50] ANALYSIS OF THE DIFFUSION-CONTROLLED GROWTH OF COBALT SILICIDES IN BULK AND THIN-FILM COUPLES
    BARGE, T
    GAS, P
    DHEURLE, FM
    JOURNAL OF MATERIALS RESEARCH, 1995, 10 (05) : 1134 - 1145