Interdiffusion, phase formation, and stress development in Cu-Pd thin-film diffusion couples: Interface thermodynamics and mechanisms

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作者：
Chakraborty, J. [1 ]
Welzel, U. [1 ]
Mittemeijer, E.J. [1 ]
机构：
[1] Max Planck Institute for Metals Research, Heisenbergstr. 3, D-70569 Stuttgart, Germany
来源：
Journal of Applied Physics | 2008年 / 103卷 / 11期
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