Electrical probing for dimensional micro metrology

被引:10
|
作者
Hoffmann, J. [1 ]
Weckenmann, A. [1 ]
Sun, Z. [1 ]
机构
[1] Univ Erlangen Nurnberg, Chair Qual Management & Mfg Metrol, Erlangen, Germany
关键词
Scanning tunnelling microscope (STM); Coordinate Measuring Machine (CMM); Sensor;
D O I
10.1016/j.cirpj.2008.06.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Each dimensional measurement is based on probed points on the surface of the measured object. However, the well-established tactile and optical probing techniques face limitations when small and delicate objects with complex shape have to be measured. With tactile measurements there is always the danger of damaging the workpiece by the probing force and the measurable point rate is quite low. With optical probing there is a principal resolution limit and accessibility to complex surfaces is hindered by the limited acceptable surface slope. Also undercuts are not measurable. To overcome these limitations a probing system based on an electrical probing interaction with a direct current of a few nanoamperes has been developed, tested and compared with traditional technologies. With this probing system coordinate measurements of micro parts as well as nanometer resolved surface topography measurements are feasible. By applying a wide range of probes accessibility problems can be drastically reduced compared to tactile or optical micro probing systems. (C) 2008 CIRP.
引用
收藏
页码:59 / 62
页数:4
相关论文
共 50 条
  • [41] Novel 3D piezoresistive silicon force sensor for dimensional metrology of micro components
    Ruther, P
    Bartholomeyczik, J
    Trautmann, A
    Wandt, M
    Paul, O
    Dominicus, W
    Roth, R
    Seitz, K
    Strauss, W
    2005 IEEE SENSORS, VOLS 1 AND 2, 2005, : 1006 - 1009
  • [42] Dimensional Accuracy in Dry Micro Wire Electrical Discharge Machining
    Ali, Mohammad Yeakub
    Banu, Asfana
    Salehan, Muhammad
    Adesta, Erry Y. T.
    Hazza, Muataz
    Shaffiq, Muhammad
    JOURNAL OF MECHANICAL ENGINEERING AND SCIENCES, 2018, 12 (01) : 3321 - 3329
  • [43] Micro and nano metrology in experimental mechanics
    Kang, Yilan
    Xie, Huimin
    OPTICS AND LASERS IN ENGINEERING, 2010, 48 (11) : 1045 - 1045
  • [44] Comparison of optical and electrical techniques for dimensional metrology on alternating aperture phase-shifting masks
    Smith, Stewart
    Tsiamis, Andreas
    McCallum, Martin
    Hourd, Andrew. C.
    Stevenson, J. Tom M.
    Walton, Anthony J.
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2008, 21 (02) : 154 - 160
  • [45] Quality measures for optical probing in optical coordinate metrology
    Toepfer, S. C. N.
    Linb, G.
    MEASUREMENT 2007: 6TH INTERNATIONAL CONFERENCE ON MEASUREMENT, PROCEEDINGS, 2007, : 164 - +
  • [46] Nonlinear viscoelastic modelling of stylus probing for surface metrology
    Tian, Y.
    Liu, X.
    Chetwynd, D. G.
    Eichhorn, V.
    Fatikow, S.
    Zhang, D.
    PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2013, 37 (03): : 711 - 720
  • [47] Computed tomography for dimensional metrology
    Kruth, J. P.
    Bartscher, M.
    Carmignato, S.
    Schmitt, R.
    De Chiffre, L.
    Weckenmann, A.
    CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2011, 60 (02) : 821 - 842
  • [48] Interferometry for wafer dimensional metrology
    Freischlad, Klaus
    Tang, Shouhong
    Grenfell, Jim
    ADVANCED CHARACTERIZATION TECHNIQUES FOR OPTICS, SEMICONDUCTORS, AND NANOTECHNOLOGIES III, 2007, 6672
  • [49] USE OF LASER IN DIMENSIONAL METROLOGY
    CARADOT, JC
    MESURES REGULATION AUTOMATISME, 1973, 38 (11): : 37 - &
  • [50] Virtual Instruments in dimensional metrology
    de Vicente y Oliva, Jesus
    Sanchez Perez, Angel Maria
    Hernandez Perdomo, Wilmar
    RESEARCH IN ENGINEERING EDUCATION SYMPOSIUM, 2011, : 106 - 118