Electrical probing for dimensional micro metrology

被引:10
|
作者
Hoffmann, J. [1 ]
Weckenmann, A. [1 ]
Sun, Z. [1 ]
机构
[1] Univ Erlangen Nurnberg, Chair Qual Management & Mfg Metrol, Erlangen, Germany
关键词
Scanning tunnelling microscope (STM); Coordinate Measuring Machine (CMM); Sensor;
D O I
10.1016/j.cirpj.2008.06.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Each dimensional measurement is based on probed points on the surface of the measured object. However, the well-established tactile and optical probing techniques face limitations when small and delicate objects with complex shape have to be measured. With tactile measurements there is always the danger of damaging the workpiece by the probing force and the measurable point rate is quite low. With optical probing there is a principal resolution limit and accessibility to complex surfaces is hindered by the limited acceptable surface slope. Also undercuts are not measurable. To overcome these limitations a probing system based on an electrical probing interaction with a direct current of a few nanoamperes has been developed, tested and compared with traditional technologies. With this probing system coordinate measurements of micro parts as well as nanometer resolved surface topography measurements are feasible. By applying a wide range of probes accessibility problems can be drastically reduced compared to tactile or optical micro probing systems. (C) 2008 CIRP.
引用
收藏
页码:59 / 62
页数:4
相关论文
共 50 条
  • [21] THE BASES OF ELECTRICAL METROLOGY
    DIX, CH
    PHYSICS IN TECHNOLOGY, 1984, 15 (04): : 184 - 190
  • [22] Dimensional metrology of micro parts by optical three-dimensional profilometry and areal surface topography analysis
    Senin, Nicola
    Blunt, Liam A.
    Tolley, Martin
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2012, 226 (A11) : 1819 - 1832
  • [23] Laser metrology in the micro-arcsecond metrology testbed
    An, X
    Marx, D
    Goullioud, R
    Zhao, F
    Advanced Sensor Systems and Applications II Pt 1and 2, 2004, 5634 : 293 - 303
  • [24] Nanometer Resolving Coordinate Metrology Using Electrical Probing Contact Less 3D Microprobing
    Hoffmann, Joerg
    Schuler, Alexander
    TM-TECHNISCHES MESSEN, 2011, 78 (03) : 142 - 149
  • [25] ACOUSTIC MICRO-METROLOGY
    WEGLEIN, RD
    IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1985, 32 (02): : 225 - 234
  • [26] Micro metrology shows growth
    不详
    SENSOR REVIEW, 2010, 30 (02) : 162 - 163
  • [27] Dimensional metrology of micro structure based on modulation depth in scanning broadband light interferometry
    Zhou, Yi
    Tang, Yan
    Deng, Qinyuan
    Zhao, Lixin
    Hu, Song
    APPLIED OPTICAL METROLOGY II, 2017, 10373
  • [28] METHODS IN MICRO-METROLOGY
    MORHOUS, JA
    MICROSCOPE, 1978, 26 (04): : 208 - 208
  • [29] DIMENSIONAL METROLOGY IN MICROELECTRONICS
    ZAHORSKY, D
    LACOMBAT, M
    ONDE ELECTRIQUE, 1988, 68 (04): : 60 - 64
  • [30] FUNDAMENTALS OF DIMENSIONAL METROLOGY
    不详
    MATERIALS RESEARCH AND STANDARDS, 1965, 5 (04): : 214 - &