USING ULTRASONIC SH-WAVES TO ESTIMATE THE QUALITY OF ADHESIVE BONDS IN PLATE STRUCTURES

被引：23
|
作者：
YEW, CH
WENG, XW
机构：
来源：
JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA | 1985年 / 77卷 / 05期
关键词：
D O I：
10.1121/1.391930
中图分类号：
O42 [声学];
学科分类号：
070206 ; 082403 ;
摘要：
引用
收藏
页码：1813 / 1823
页数：11
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