USING ULTRASONIC SH-WAVES TO ESTIMATE THE QUALITY OF ADHESIVE BONDS IN PLATE STRUCTURES

被引:23
|
作者
YEW, CH
WENG, XW
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D O I
10.1121/1.391930
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
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页码:1813 / 1823
页数:11
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