CURRENT CROWDING IN HIGH-DENSITY VLSI METALLIZATION STRUCTURES

被引:2
|
作者
PIMBLEY, JM
BROWN, DM
机构
关键词
D O I
10.1109/T-ED.1986.22682
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:1399 / 1401
页数:3
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