DEVELOPMENT AND EVALUATION OF A PLANAR HEAT PIPE FOR COOLING ELECTRONIC SYSTEMS

被引:9
|
作者
ADAMI, M
YIMER, B
机构
[1] University of Kansas, Department of Mechanical Engineering, Lawrence
关键词
Electronic cooling; Heat pipe; Heat transfer; Planar heat pipe;
D O I
10.1080/00986449008940577
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
A planar heat pipe (rectangular cross section) was designed, built and tested using flexible electrical rubber heaters to provide the necessary heat. The device was constructed from 0.043” (0.1092 cm) copper sheet, with three layers of 100-mesh copper screen as a capillary wick. The dimensions of the planar heat pipe were 6 inches (15.24 cm) by 12 inches (30.48cm) by 3/4 inches (1,905 cm). Water was used as the working fluid. Steady state, and in once case, transient responses, were investigated. External axial temperature profiles for different applied powers and operating temperatures were measured. Operation of the device was stable and repeatable within a temperature range of 30° to 95°C; no temperature or pressure fluctuations were noted. The optimum amount of working fluid for a typical situation was obtained experimentally. Effects of air and amount of working fluid inside the planar heat pipe were investigated. The optimum amount of working fluid which was obtained experimentally was used throughout the remaining tests in this research. Effects of gravity, a wide range of operating temperature, Reynolds number at constant input power, and Reynolds number at constant operating temperature were investigated. The maximum heat transfer rate of the planar heat pipe was obtained experimentally and compared to it is theoretical value. Good agreement was obtained between the two values. © 1990, Taylor & Francis Group, LLC. All rights reserved.
引用
收藏
页码:57 / 74
页数:18
相关论文
共 50 条
  • [41] Experimental investigation of flat porous heat pipe for cooling TV box electronic chips
    Zeghari, K.
    Louahlia, H.
    Le Masson, S.
    APPLIED THERMAL ENGINEERING, 2019, 163
  • [42] Heat pipe technology for refrigeration and cooling
    Smirnov, HF
    LOW TEMPERATURE AND CRYOGENIC REFRIGERATION, 2003, 99 : 349 - 372
  • [43] A NEW HEAT PIPE COOLING DEVICE
    Comanescu, Dinu
    Comanescu, Adriana
    Filipoiu, Iaon Dan
    Alionte, Cristian Gabriel
    ANNALS OF DAAAM FOR 2008 & PROCEEDINGS OF THE 19TH INTERNATIONAL DAAAM SYMPOSIUM, 2008, : 303 - 304
  • [44] Vibration actions on heat pipes as cooling element of electronic systems
    Prisniakov, KV
    Nikolaenko, YE
    Prisniakov, VF
    THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2002, : 261 - 267
  • [45] EFFECTIVENESS OF A PLANAR HEAT PIPE IN REMOVING BATTERY HEAT
    MAHEFKEY, ET
    KREITMAN, MM
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1971, 16 (08): : 856 - &
  • [46] Development and experimental study of a 3-dimensional enhanced heat pipe radiator for cooling high-power electronic devices
    Gan, Ke
    Li, Ruilian
    Zheng, Yi
    Xu, Hui
    Gao, Ying
    Qian, Jiajie
    Wei, Ziming
    Kong, Bin
    Zhang, Hong
    APPLIED THERMAL ENGINEERING, 2024, 238
  • [47] Modelling and evaluation of cooling capacity of earth-air-pipe systems
    Wu, Huijun
    Wang, Shengwei
    Zhu, Dongsheng
    ENERGY CONVERSION AND MANAGEMENT, 2007, 48 (05) : 1462 - 1471
  • [48] Integrated heat pipe heat sink for cooling CPU
    Bai, Minli
    Xi, Na
    Sun, Zhijun
    Li, He
    Yang, Hongwu
    Gaojishu Tongxin/Chinese High Technology Letters, 2006, 16 (07): : 713 - 717
  • [49] Experimental investigation on thermal characteristics of a novel loop heat pipe for cooling high heat flux electronic chips
    Xiong, Kangning
    Meng, Like
    Wang, Shuangfeng
    Zhang, L. Winston
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2022, 187
  • [50] DEVELOPMENT OF A ROBUST MINIATURE LOOP HEAT PIPE FOR HIGH POWER CHIP COOLING
    Li, Ji
    Wang, Daming
    Peterson, G. P.
    PROCEEDINGS OF THE ASME MICRO/NANOSCALE HEAT AND MASS TRANSFER INTERNATIONAL CONFERENCE, VOL 3, 2010, : 347 - 354