DEVELOPMENT AND EVALUATION OF A PLANAR HEAT PIPE FOR COOLING ELECTRONIC SYSTEMS

被引:9
|
作者
ADAMI, M
YIMER, B
机构
[1] University of Kansas, Department of Mechanical Engineering, Lawrence
关键词
Electronic cooling; Heat pipe; Heat transfer; Planar heat pipe;
D O I
10.1080/00986449008940577
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
A planar heat pipe (rectangular cross section) was designed, built and tested using flexible electrical rubber heaters to provide the necessary heat. The device was constructed from 0.043” (0.1092 cm) copper sheet, with three layers of 100-mesh copper screen as a capillary wick. The dimensions of the planar heat pipe were 6 inches (15.24 cm) by 12 inches (30.48cm) by 3/4 inches (1,905 cm). Water was used as the working fluid. Steady state, and in once case, transient responses, were investigated. External axial temperature profiles for different applied powers and operating temperatures were measured. Operation of the device was stable and repeatable within a temperature range of 30° to 95°C; no temperature or pressure fluctuations were noted. The optimum amount of working fluid for a typical situation was obtained experimentally. Effects of air and amount of working fluid inside the planar heat pipe were investigated. The optimum amount of working fluid which was obtained experimentally was used throughout the remaining tests in this research. Effects of gravity, a wide range of operating temperature, Reynolds number at constant input power, and Reynolds number at constant operating temperature were investigated. The maximum heat transfer rate of the planar heat pipe was obtained experimentally and compared to it is theoretical value. Good agreement was obtained between the two values. © 1990, Taylor & Francis Group, LLC. All rights reserved.
引用
收藏
页码:57 / 74
页数:18
相关论文
共 50 条
  • [21] Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling
    Kumar, K. R. Suresh
    Dinesh, R.
    Roseline, A. Ameelia
    Kalaiselvam, S.
    MICROELECTRONICS RELIABILITY, 2017, 73 : 1 - 13
  • [22] DEVELOPMENT AND CHARACTERIZATION OF A LOOP HEAT PIPE WITH A PLANAR EVAPORATOR AND CONDENSER
    Kariya, H. Arthur
    Hanks, Daniel F.
    Peters, Teresa B.
    Brisson, John G.
    Wang, Evelyn N.
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 10, PTS A AND B, 2012, : 857 - 862
  • [23] Development of a MEMS micro loop heat pipe for electronics cooling
    Shuja, A.
    Parimi, S.
    Medis, P.
    Gerner, F. M.
    Henderson, H. T.
    Gerner, F. M.
    THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2007, : 233 - +
  • [24] DEVELOPMENT OF A CRYOGENIC HEAT PIPE RADIATOR FOR A DETECTOR COOLING SYSTEM
    WRIGHT, JP
    PENCE, WR
    MECHANICAL ENGINEERING, 1973, 95 (10) : 70 - 70
  • [25] Energy Analysis of Flattened Heat Pipe with Nanofluids for Sustainable Electronic Cooling Applications
    Rangasamy, Sankar
    Raghavan, Raghavendra Rajan Vijaya
    Elavarasan, Rajvikram Madurai
    Kasinathan, Padmanathan
    SUSTAINABILITY, 2023, 15 (06)
  • [26] Temperature distribution of a low temperature heat pipe with multiple heaters for electronic cooling
    Noh, HK
    Song, KS
    ETRI JOURNAL, 1998, 20 (04) : 380 - 394
  • [27] Visualization study of a flat confined loop heat pipe for electronic devices cooling
    Wang, Xianling
    Yang, Jingxuan
    Wen, Qiaowei
    Shittu, Samson
    Liu, Guangming
    Qiu, Zining
    Zhao, Xudong
    Wang, Zhangyuan
    APPLIED ENERGY, 2022, 322
  • [28] A novel flat polymer heat pipe with thermal via for cooling electronic devices
    Yang, Kai-Shing
    Yang, Tsung-Yi
    Tu, Cheng-Wei
    Yeh, Chih-Ting
    Lee, Ming-Tsang
    ENERGY CONVERSION AND MANAGEMENT, 2015, 100 : 37 - 44
  • [29] Application of Paraffin Based Nanocomposite in Heat Pipe Module for Electronic Equipment Cooling
    Chougule, Sandesh. S.
    Nirgude, Vishal V.
    Shewale, Sapana P.
    Pise, Ashok T.
    Sahu, S. K.
    Shah, Hardik
    MATERIALS TODAY-PROCEEDINGS, 2018, 5 (11) : 23333 - 23338
  • [30] Visualization study of a flat confined loop heat pipe for electronic devices cooling
    Wang, Xianling
    Yang, Jingxuan
    Wen, Qiaowei
    Shittu, Samson
    Liu, Guangming
    Qiu, Zining
    Zhao, Xudong
    Wang, Zhangyuan
    APPLIED ENERGY, 2022, 322