SELECTIVE REMOVAL OF METAL ATOMS IN HYDROGEN REACTIVE ION ETCHING

被引:5
|
作者
HIRAOKA, H
机构
[1] IBM, San Jose, CA, USA, IBM, San Jose, CA, USA
来源
关键词
DRY STRIPPING - HYDROGEN REACTIVE ION ETCHING - ORGANOMETALLIC RESIST FILMS - POSITIVE TONE POLYMER IMAGES;
D O I
10.1116/1.583328
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:345 / 348
页数:4
相关论文
共 50 条
  • [21] Reactive ion etching of zinc oxide using methane and hydrogen
    Guo, Qixin
    Uesugi, Nozomu
    Tanaka, Tooru
    Nishio, Mitsuhiro
    Ogawa, Hiroshi
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (11): : 8597 - 8599
  • [22] SELECTIVE REACTIVE ION ETCHING OF GAAS/ALGAAS METAL-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS
    CAMERON, NI
    HOPKINS, G
    THAYNE, IG
    BEAUMONT, SP
    WILKINSON, CDW
    HOLLAND, M
    KEAN, AH
    STANLEY, CR
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (06): : 3538 - 3541
  • [23] REACTIVE ION ETCHING
    ZIELINSKI, L
    SCHWARTZ, GC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (03) : C71 - C71
  • [24] Reactive ion etching of semiconductor materials and of dielectric and metal layers
    Novotny, Zdenek
    Tesla electronics, 1986, 19 (3-4): : 59 - 62
  • [25] Reactive ion etching for the production of metal microstructures by hot embossing
    O. Roetting
    M. Heckele
    W. Bacher
    Microsystem Technologies, 1999, 6 : 11 - 14
  • [26] Reactive ion etching for the production of metal microstructures by hot embossing
    Roetting, O
    Heckele, M
    Bacher, W
    MICROSYSTEM TECHNOLOGIES, 1999, 6 (01) : 11 - 14
  • [27] REMOVAL OF SURFACE CONTAMINATION AFTER REACTIVE ION ETCHING OF SILICON DIOXIDE
    JACKSON, R
    PIDDUCK, AJ
    GREEN, MA
    VACUUM, 1994, 45 (05) : 519 - 524
  • [28] Effect of Hydrogen Ion Energy in the Process of Reactive Ion Etching of Sn Thin Films by Hydrogen Plasmas
    Ji, Mengran
    Nagata, Ryo
    Uchino, Kiichiro
    PLASMA AND FUSION RESEARCH, 2021, 16 : 1406003 - 1
  • [29] HIGHLY ANISOTROPIC SELECTIVE REACTIVE ION ETCHING OF DEEP TRENCHES IN SILICON
    YUNKIN, VA
    FISCHER, D
    VOGES, E
    MICROELECTRONIC ENGINEERING, 1994, 23 (1-4) : 373 - 376
  • [30] Reactive ion beam etching using a selective gallium doping method
    Nishioka, Kyusaku
    Morimoto, Hiroaki
    Mashiko, Yoji
    Kato, Tadao
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1989, 28 (09): : 1671 - 1672