Anodic bonding using a hybrid electrode with a two-step bonding process

被引：3
|
作者：
Luo Wei [1 ]
Xie Jing [1 ]
Zhang Yang [1 ]
Li Chaobo [1 ]
Xia Yang [1 ]
机构：
[1] Chinese Acad Sci, Inst Microelectron, Key Lab Microelectron Devices & Integrated Techno, Beijing 100029, Peoples R China
来源：
JOURNAL OF SEMICONDUCTORS | 2012年 / 33卷 / 06期
关键词：
wafer bonding; anodic bonding; electrode configuration; bubble-free;
D O I：
10.1088/1674-4926/33/6/066001
中图分类号：
O469 [凝聚态物理学];
学科分类号：
070205 ;
摘要：
A two-step bonding process using a novel hybrid electrode is presented. The effects of different electrodes on bonding time, bond strength and the bonded interface are analyzed. The anodic bonding is studied using a domestic bonding system, which carries out a detailed analysis of the integrity of the bonded interface and the bond strength measurement. With the aid of the hybrid electrode, a bubble-free anodic bonding process could be accomplished within 15-20 min, with a shear strength in excess of 10 MPa. These results show that the proposed method has a high degree of application value, including in most wafer-level MEMS packaging.
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收藏
页数：4
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