METALLIZATION FOR INTEGRATED-CIRCUITS USING A LIFT-OFF TECHNIQUE

被引：27
|
作者：
WIDMANN, DW [1 ]
机构：
[1] SIEMENS AG,RES LABS,MUNICH,FED REP GER
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1976年 / 11卷 / 04期
关键词：
D O I：
10.1109/JSSC.1976.1050760
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：466 / 471
页数：6
相关论文
共 50 条
  • [21] A Novel Nanofabrication Damascene Lift-Off Technique
    Maraghechi, P.
    Cadien, K.
    Elezzabi, A. Y.
    IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2011, 10 (04) : 822 - 826
  • [22] X-RAY MASK METALLIZATION BY MULTILAYER RESIST LIFT-OFF
    CHANG, MS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) : C112 - C112
  • [23] LIFT-OFF TECHNIQUE USING DIFFERENT E-BEAM WRITERS
    Chlumska, Jana
    Kolarik, Vladimir
    Kratky, Stanislav
    Matejka, Milan
    Urbanek, Michal
    Horacek, Miroslav
    NANOCON 2013, 5TH INTERNATIONAL CONFERENCE, 2014, : 286 - 290
  • [24] TRILAYER LIFT-OFF METALLIZATION PROCESS USING LOW-TEMPERATURE DEPOSITED SIN(X)
    LOTHIAN, JR
    REN, F
    PEARTON, SJ
    CHAKRABARTI, UK
    ABERNATHY, CR
    KATZ, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1992, 10 (06): : 2361 - 2365
  • [25] MOLYBDENUM METALLIZATION SYSTEM FOR LARGE-SCALE INTEGRATED-CIRCUITS
    OIKAWA, H
    WADA, T
    AMAZAWA, T
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1976, 24 (5-6): : 407 - 417
  • [26] APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS
    GHATE, PB
    BLAIR, JC
    FULLER, CR
    MCGUIRE, GE
    THIN SOLID FILMS, 1978, 53 (02) : 117 - 128
  • [27] SIMULATION OF ELECTROMIGRATION BEHAVIOR IN A1 METALLIZATION OF INTEGRATED-CIRCUITS
    SCHERGE, M
    BRETERNITZ, V
    KNEDLIK, C
    MICROELECTRONICS AND RELIABILITY, 1992, 32 (1-2): : 21 - 24
  • [28] HIGH-RATE SPUTTERING OF ALUMINUM FOR METALLIZATION OF INTEGRATED-CIRCUITS
    MCLEOD, PS
    HARTSOUGH, LD
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01): : 263 - 265
  • [29] STRESS-INDUCED VOID FORMATION IN METALLIZATION FOR INTEGRATED-CIRCUITS
    OKABAYASHI, H
    MATERIALS SCIENCE & ENGINEERING R-REPORTS, 1993, 11 (05): : 189 - 241
  • [30] ATOMISTIC AND COMPUTER MODELING OF METALLIZATION FAILURE OF INTEGRATED-CIRCUITS BY ELECTROMIGRATION
    KIRCHHEIM, R
    KAEBER, U
    JOURNAL OF APPLIED PHYSICS, 1991, 70 (01) : 172 - 181
12345