Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

被引:0
|
作者
P.S. Sreejith
G. Udupa
Y.B.M. Noor
B.K.A. Ngoi
机构
[1] Precision Engineering Strategic Research Programme,
[2] School of Mechanical and Production Engineering,undefined
[3] Nanyang Technological University,undefined
[4] Nanyang,undefined
[5] Singapore,undefined
关键词
Keywords:Chemical mechanical polishing; Grinding; Roughness; Semiconductor; Silicon wafer; Total thickness variation; Turning;
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摘要
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页码:157 / 162
页数:5
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