Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

被引：0
|
作者：
P.S. Sreejith
G. Udupa
Y.B.M. Noor
B.K.A. Ngoi
机构：
[1] Precision Engineering Strategic Research Programme,
[2] School of Mechanical and Production Engineering,undefined
[3] Nanyang Technological University,undefined
[4] Nanyang,undefined
[5] Singapore,undefined
来源：
The International Journal of Advanced Manufacturing Technology | 2001年 / 17卷
关键词：
Keywords:Chemical mechanical polishing; Grinding; Roughness; Semiconductor; Silicon wafer; Total thickness variation; Turning;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：157 / 162
页数：5
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