Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging

被引:0
|
作者
Chih-Yao Liu
Moo-Chin Wang
Min-Hsiung Hon
机构
[1] National Cheng Kung University,Department of Materials Science and Engineering
[2] Department of Materials Science and Engineering National United University,undefined
[3] Dayeh University,undefined
来源
Journal of Electronic Materials | 2006年 / 35卷
关键词
Lead-free solder; Cu substrate; interfacial adhesion strength; intermetallic compounds (IMCs);
D O I
暂无
中图分类号
学科分类号
摘要
The reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging has been investigated. Due to the growth and decomposition of the intermetallic compound (IMC), the adhesion strength varies with aging at 150°C from 100, 400, and 700–1,000 h as wetted at 250°C for 60 sec. The IMC layers are determined at the Sn-9Zn-1.5Ag-0.5Bi/Cu interface by an x-ray diffractometer (XRD), an optical microscope (OM), a scanning electron microscope (SEM), an energy-dispersive spectroscope (EDS), and a transmission electron microscope (TEM). The adhesion strength has been investigated by the pull-off test. The results show that the Cu6Sn5, Cu5Zn8, and Ag3Sn IMCs are identified at the Sn-9Zn-1.5Ag-0.5Bi/Cu interface as aging. The adhesion strengths are 12.44±0.58, 8.57±0.43, 5.50±0.78, 4.32±0.78, and 3.32±0.43 MPa for aging times of 0 h, 100 h, 400 h, 700 h, and 1,000 h, respectively.
引用
收藏
页码:966 / 971
页数:5
相关论文
共 50 条
  • [31] Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
    Wang, Feng-Jiang
    Gao, Feng
    Ma, Xin
    Qian, Yi-Yu
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (10) : 1818 - 1824
  • [32] Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
    Feng-Jiang Wang
    Feng Gao
    Xin Ma
    Yi-Yu Qian
    Journal of Electronic Materials, 2006, 35 : 1818 - 1824
  • [33] Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn-9Zn-xAg/Cu interface
    Chang, TC
    Wang, MC
    Hon, MH
    JOURNAL OF CRYSTAL GROWTH, 2003, 252 (1-3) : 391 - 400
  • [34] The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process
    Qi, L
    Zhao, J
    Wang, XM
    Wang, L
    2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, : 42 - 46
  • [35] Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging
    Liu, Bin
    Guo, Fu
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2010, 17 (04) : 453 - 458
  • [36] Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging
    Bin Liu
    Fu Guo
    International Journal of Minerals, Metallurgy, and Materials, 2010, 17 : 453 - 458
  • [38] Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging
    Jianxin Wang
    Hao Su
    Dekui Mu
    Xingda Kong
    Yiming Jin
    Xixi Shi
    Journal of Materials Science: Materials in Electronics, 2021, 32 : 20777 - 20792
  • [39] Investigation on the intermetallic compound layer growth of Sn-0.5Ag-0.7Cu-xGa/Cu solder joints during isothermal aging
    Luo, Dong-xue
    Xue, Song-bai
    Liu, Shuang
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (12) : 5195 - 5200
  • [40] Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints
    Othman, R.
    Binh, D. N.
    Ismail, A. B.
    Long, B. D.
    Ariga, T.
    INTERMETALLICS, 2012, 22 : 1 - 6