Positron annihilation studies of subsurface zones incopper

被引：0
|
作者：
J. Dryzek
E. Dryzek
T. Stegemann
B. Cleff
机构：
来源：
Tribology Letters | 1997年 / 3卷
关键词：
Copper; Physical Chemistry; Thin Film; Exponential Decay; Positron Annihilation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper presents the results of positron annihilation studiesof defect profiles in well-annealed copper samples whosesurfaces were exposed to wear and friction processes. The defectprofiles exhibited exponential decay. The dependence of thedefect distribution behavior on the load, duration of the pin-on-disc test, the temperature of the sample and the velocity ofthe ball were studied. The defect profile induced bytribotesting was compared with its analogues in samplessubjected to cutting or compression.
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页码：269 / 275
页数：6
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