Positron annihilation studies of subsurface zones incopper

被引:0
|
作者
J. Dryzek
E. Dryzek
T. Stegemann
B. Cleff
机构
来源
Tribology Letters | 1997年 / 3卷
关键词
Copper; Physical Chemistry; Thin Film; Exponential Decay; Positron Annihilation;
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学科分类号
摘要
This paper presents the results of positron annihilation studiesof defect profiles in well-annealed copper samples whosesurfaces were exposed to wear and friction processes. The defectprofiles exhibited exponential decay. The dependence of thedefect distribution behavior on the load, duration of the pin-on-disc test, the temperature of the sample and the velocity ofthe ball were studied. The defect profile induced bytribotesting was compared with its analogues in samplessubjected to cutting or compression.
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页码:269 / 275
页数:6
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