Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method

被引：0
|
作者：
A. L. Glazov
V. S. Kalinovskii
E. V. Kontrosh
K. L. Muratikov
机构：
[1] Ioffe Institute,
来源：
Technical Physics Letters | 2023年 / 49卷
关键词：
thermal resistance; multi-junction solar cells; lead-free solder; non-destructive testing; thermal waves;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：265 / 268
页数：3
相关论文
共 50 条
  • [41] Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
    Ekpu, Mathias
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2021, 33 (05) : 249 - 257
  • [42] Effect of void formation on thermal fatigue reliability of lead-free solder joints
    Kim, DS
    Yu, Q
    Shibutani, T
    Sadakata, N
    Inoue, T
    ITHERM 2004, VOL 2, 2004, : 325 - 329
  • [43] Effects of voids on thermal-mechanical reliability of lead-free solder joints
    Benabou, Lahouari
    Van Nhat Le
    Sun, Zhidan
    Pougnet, Philippe
    Etgens, Victor
    FDMD II - JIP 2014 - FATIGUE DESIGN & MATERIAL DEFECTS, 2014, 12
  • [44] Anharmonicity and Ultralow Thermal Conductivity in Lead-Free Halide Double Perovskites
    Klarbring, Johan
    Hellman, Olle
    Abrikosov, Igor A.
    Simak, Sergei, I
    PHYSICAL REVIEW LETTERS, 2020, 125 (04)
  • [45] Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders
    Aksoz, Namik
    Ozturk, Esra
    Bayram, Umit
    Aksoz, Sezen
    Kervan, Selcuk
    Ulgen, Ahmet
    Marasli, Necmettin
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (12) : 3573 - 3581
  • [46] Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders
    Namık Aksöz
    Esra Öztürk
    Ümit Bayram
    Sezen Aksöz
    Selçuk Kervan
    Ahmet Ülgen
    Necmettin Maraşlı
    Journal of Electronic Materials, 2013, 42 : 3573 - 3581
  • [47] Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance
    Cao, Xiao
    Wang, Tao
    Ngo, Khai D. T.
    Lu, Guo-Quan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04): : 495 - 501
  • [48] The Variations of Electron and Phonon Contributions to the Thermal Conductivity with Temperature in the Sn–Bi–In–Zn Alternative Lead-Free Solder Alloys
    Sezen Pınar Ata Esener
    Esra Aksöz
    Necmettin Öztürk
    Physics of Metals and Metallography, 2020, 121 : 1365 - 1374
  • [49] Comparative shear tests of some low temperature lead-free solder pastes
    Branzei, Mihai
    Plotog, Ioan
    Varzaru, Gaudentiu
    Cucu, Traian C.
    ADVANCED TOPICS IN OPTOELECTRONICS, MICROELECTRONICS, AND NANOTECHNOLOGIES VIII, 2016, 10010
  • [50] Testing of lead-free solder pastes for component soldering on printed and hybrid circuits
    Rocak, D
    Zupan, M
    Fajfar-Plut, J
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2002, 32 (02): : 88 - 94
12345