共 50 条
- [22] Thermal mechanical property testing of new lead-free solder joints Soldering and Surface Mount Technology, 1997, (27): : 37 - 40
- [23] A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue Journal of Materials Science: Materials in Electronics, 2018, 29 : 7501 - 7509
- [26] Lead-free soldering technology review -: Evaluating solder pastes and stencils 2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2006, : 240 - +
- [27] Effective thermal conductivity of porous solder layers IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (02): : 259 - 267
- [28] Reliability of lead-free solder joints in CSP device under thermal cycling Journal of Materials Science: Materials in Electronics, 2014, 25 : 1209 - 1213
- [29] Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 95 - +