PSpice modeling of thermal performance in laser diodes packaging

被引：1
|
作者：
Zhou, Sheng [1 ]
Zhang, Xiupu [1 ]
机构：
[1] Concordia Univ, Dept Elect & Comp Engn, 1455 de Maisonneuve W, Montreal, PQ H3G 1M8, Canada
来源：
2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2006年
关键词：
D O I：
10.1109/LEOS.2006.278947
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A PSpice model for laser diodes packaging was established to simulate its thermal behavior and cooling performance. Some heuristic analysis has been made by this model with concept clarity and simplicity.
引用
收藏
页码：172 / +
页数：2
相关论文
共 50 条
  • [41] Circuit modeling of multimode bistable laser diodes
    Madhan, MG
    Vaya, PR
    Gunasekaran, N
    IEEE PHOTONICS TECHNOLOGY LETTERS, 1999, 11 (01) : 27 - 29
  • [42] Diffractive optics for photonic packaging of laser diodes and fiber-optics
    Feldman, MR
    Welch, WH
    TeKolste, RD
    Morris, JE
    LASER DIODE CHIP AND PACKAGING TECHNOLOGY, 1996, 2610 : 204 - 213
  • [43] Performance Characteristics of High Speed Laser Diodes under Thermal-Irradiated Operating Conditions
    El-Badawy, El-Sayed A.
    Mohammed, Abd El-Naser A.
    El-Abyads, Gaber E. M.
    Tabbour, Mohammed S. F.
    2009 6TH INTERNATIONAL SYMPOSIUM ON HIGH CAPACITY OPTICAL NETWORKS AND ENABLING TECHNOLOGIES (HONET 2009), 2009, : 142 - +
  • [44] The effect of rapid thermal annealing to device performance of InGaAs/AlGaAs quantum well laser diodes
    Gareso, P. L.
    Buda, M.
    Tan, H. H.
    Jagadish, C.
    INDIAN JOURNAL OF PURE & APPLIED PHYSICS, 2017, 55 (05) : 333 - 338
  • [45] Online measurement and correction of post-weld shift in laser welding packaging for laser diodes
    Yulie Wu
    Haitao Yang
    Shengyi Li
    The International Journal of Advanced Manufacturing Technology, 2010, 46 : 135 - 142
  • [46] Detailed Study of Optical and Thermal Performance for White Light-Emitting Diodes With Filament-Like Packaging Structures
    Liang, Guanwei
    Tang, Yong
    Lu, Zhou
    Wu, Kejian
    Li, Zongtao
    Li, Jiasheng
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (12): : 2018 - 2026
  • [47] Online measurement and correction of post-weld shift in laser welding packaging for laser diodes
    Wu, Yulie
    Yang, Haitao
    Li, Shengyi
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2010, 46 (1-4): : 135 - 142
  • [48] Analysis of thermal properties of GaInN light-emitting diodes and laser diodes
    Shan, Qifeng
    Dai, Qi
    Chhajed, Sameer
    Cho, Jaehee
    Schubert, E. Fred
    JOURNAL OF APPLIED PHYSICS, 2010, 108 (08)
  • [49] New methodology for the assessment of the thermal resistance of laser diodes and light emitting diodes
    Veyrie, David
    Gilard, Olivier
    Sanchez, Kevin
    Lhuillier, Sebastien
    Bourcier, Frederic
    MICROELECTRONICS RELIABILITY, 2010, 50 (04) : 456 - 461
  • [50] Modeling the impact of packaging stress on device performance
    Xu, XP
    Moroz, V
    Materials, Technology and Reliability of Advanced Interconnects-2005, 2005, 863 : 339 - 344
12345