PSpice modeling of thermal performance in laser diodes packaging

被引：1
|
作者：
Zhou, Sheng [1 ]
Zhang, Xiupu [1 ]
机构：
[1] Concordia Univ, Dept Elect & Comp Engn, 1455 de Maisonneuve W, Montreal, PQ H3G 1M8, Canada
来源：
2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2006年
关键词：
D O I：
10.1109/LEOS.2006.278947
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A PSpice model for laser diodes packaging was established to simulate its thermal behavior and cooling performance. Some heuristic analysis has been made by this model with concept clarity and simplicity.
引用
收藏
页码：172 / +
页数：2
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