Improved model for single-event burnout mechanism

被引:19
|
作者
Kuboyama, S [1 ]
Ikeda, N
Hirao, T
Matsuda, S
机构
[1] Japan Aerosp Explorat Agcy, Tsukuba, Ibaraki 3058505, Japan
[2] Japan Atom Energy Res Inst, Takasaki, Gumma 3701292, Japan
关键词
avalanche multiplication; bipolar junction transistor (BJT); energetic particle induced charge spectroscopy; (EPICS); power MOSFET; single-event burnout (SEB);
D O I
10.1109/TNS.2004.839512
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We describe an improved model for single-event burnout (SEB) mechanism. The model includes the direct tunneling of carriers at the interface of epitaxial layer and substrate. Compared with our previous models, the new model is more successful in reproducing the voltage dependence of the collected charge when incident heavy ions strike the emitter area. The model clearly explains the reason why the emitter stripe region was more susceptible to SEBs.
引用
收藏
页码:3336 / 3341
页数:6
相关论文
共 50 条
  • [31] A compact circuit-level model for single-event burnout in SiC power MOSFET devices
    Shen, Pei
    Wang, Ying
    Li, Xing-Ji
    Yang, Jian-qun
    Cao, Fei
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2022, 61 (12)
  • [32] EVIDENCE FOR A PERMANENT SINGLE-EVENT UPSET MECHANISM
    MEULENBERG, A
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1984, 31 (06) : 1280 - 1283
  • [33] A compact circuit-level model for single-event burnout in SiC power MOSFET devices
    Shen, Pei
    Wang, Ying
    Li, Xing-Ji
    Yang, Jian-Qun
    Cao, Fei
    Japanese Journal of Applied Physics, 2022, 61 (12):
  • [34] Sensitivity and Mechanism Study of Single-Event Burnout in 4H-SiC Devices With FLRs Termination
    Liu, Keyu
    Tang, Xiaoyan
    Yuan, Hao
    Song, Qingwen
    Liu, Yancong
    Zhou, Yu
    Du, Fengyu
    Zhang, Yuming
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 70 (06) : 3196 - 3201
  • [35] Single-Event Burnout Hardening of Power UMOSFETs With Integrated Schottky Diode
    Wang, Ying
    Yu, Cheng-Hao
    Dou, Zheng
    Xue, Wei
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (05) : 1464 - 1469
  • [36] Single-Event Burnout Hardened Structure of Power UMOSFETs With Schottky Source
    Wang, Ying
    Zhang, Yue
    Cao, Fei
    Shan, Ming-Guang
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2014, 29 (07) : 3733 - 3737
  • [37] Simulation Study of Single-Event Burnout in GaN MISFET With Schottky Element
    Wang, Ying
    Fei, Xin-Xing
    Wu, Xue
    Li, Xingji
    Yang, Jianqun
    Bao, Mengtian
    Cao, Fei
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (12) : 5466 - 5471
  • [38] SIMULATING SINGLE-EVENT BURNOUT OF N-CHANNEL POWER MOSFETS
    JOHNSON, GH
    HOHL, JH
    SCHRIMPF, RD
    GALLOWAY, KF
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (05) : 1001 - 1008
  • [39] Influence of Accumulated Radiation Effects on Single-Event Burnout in SiC MOSFETs
    Wu, Lei
    Dong, Shangli
    Xu, Xiaodong
    Wei, Yadong
    Liu, Zhongli
    Li, Weiqi
    Yang, Jianqun
    Li, Xingji
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2024, 71 (08) : 1978 - 1988
  • [40] Mechanism and Physical Model of the Single-Event Leakage Current for SiC JBS Diodes
    Dong, Xiaoping
    Huang, Mingmin
    Ma, Yao
    Fu, Chengwen
    He, Mu
    Yang, Zhimei
    Li, Yun
    Gong, Min
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2024, 71 (10) : 2252 - 2259