Taming Temperature In High-Power PIN Switches

被引：0
|
作者：
Hebert, Michael [1 ]
机构：
[1] Micronetics Inc, Hudson, NH 03051 USA
来源：
MICROWAVES & RF | 2010年 / 49卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thermal management efforts for high-power PIN diode switches should include a combination of test equipment and software, using thermal imaging and 3D thermal modeling, respectively.
引用
收藏
页码：63 / +
页数：4
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