Taming Temperature In High-Power PIN Switches

被引：0

作者：

Hebert, Michael ^{[1
]}

机构：

[1] Micronetics Inc, Hudson, NH 03051 USA

来源：

MICROWAVES & RF | 2010年 / 49卷 / 05期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermal management efforts for high-power PIN diode switches should include a combination of test equipment and software, using thermal imaging and 3D thermal modeling, respectively.

引用

页码：63 / +

页数：4

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