Contamination control in 300mm foundry

被引：0
|
作者：
Hsu, HJ [1 ]
Chen, IC [1 ]
Jann, L [1 ]
机构：
[1] Taiwan Semicond Mfg Co Ltd, Hsinchu 300, Taiwan
来源：
2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP | 2002年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
In the normal wafer process flow, the contamination problem must not happen except a little of RD research lots. In 300mm FAB, we put multiple lots in a carrier to improve the operation efficiency. This feature reduces the cost but increase the risk of contamination disaster very much. A lot coated with the photo resist must be prevented from entering a furnace. The mixed frond-end and back-end processed lots could have contamination issue after study. New research material, like Cooper, will affect the yield if they are not separated with aluminum. All of them are the scope of the contamination control.
引用
收藏
页码：212 / 214
页数：3
相关论文
共 50 条
  • [1] Containment of contamination on 300mm furnaces
    Kurtenbach, A
    Breeden, T
    Kürner, W
    Storbeck, O
    Tucker, M
    2000 PROCEEDINGS: INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY, 2000, : 11 - 16
  • [2] In 300mm contamination control, watch out for electrostatic attraction
    Levit, LB
    Hanley, TM
    Curran, F
    SOLID STATE TECHNOLOGY, 2000, 43 (06) : 209 - +
  • [3] Expeditious hot lots handling in 300mm semiconductor foundry
    Wang, Chia-Nan
    Liao, Da-Yin
    2006 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN, AND CYBERNETICS, VOLS 1-6, PROCEEDINGS, 2006, : 4677 - +
  • [4] UMC eyes 300mm fab, names foundry ops head
    不详
    SOLID STATE TECHNOLOGY, 1999, 42 (09) : 38 - 38
  • [5] 300mm factory automation experience and challenges for wafer foundry fabs
    Hung, CH
    Lin, LR
    2001 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2001, : 377 - 380
  • [6] Prioritized automatic material handling services in 300mm foundry manufacturing
    Wang, CN
    Liao, DY
    2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP, 2002, : 109 - 114
  • [7] Factory automation migration experience for foundry Fab from 200mm to 300mm
    Lin, LR
    Chu, HL
    Hung, CH
    Lee, YC
    Yeh, PC
    2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP, 2002, : 278 - 281
  • [8] Microeconomics of 300mm process module control
    Monahan, KM
    Chatterjee, A
    Falessi, G
    Levy, A
    Stoller, M
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XV, 2001, 4344 : 530 - 543
  • [9] A 300mm Foundry HRSOI Technology with Variable Silicon Thickness for Integrated FEM Applications
    Toh, Rui Tze
    Parthasarathy, Shyam
    Sun, Tao
    Zhang, Shaoqiang
    Purakh, Raj Verma
    Zhu, Chao Song
    Nune, Venkata Sudheer
    Wong, Jen Shuang
    Govindarajan, Madabusi
    Yoo, Yong Koo
    Chew, Kok Wai
    Ang, Diing Shenp
    2016 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2016,
  • [10] Effective OHT dispatching for differentiated material handling services in 300mm wafer foundry
    Wang, CN
    Liao, DY
    2003 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION, VOLS 1-3, PROCEEDINGS, 2003, : 1027 - 1032
12345