Vertical Arbitration-Free 3-D NoCs

被引:1
|
作者
More, Ankit [1 ]
Pano, Vasil [2 ]
Taskin, Baris [2 ]
机构
[1] Intel Corp, Santa Clara, CA 95054 USA
[2] Drexel Univ, Elect & Comp Engn Dept, Philadelphia, PA 19104 USA
基金
美国国家科学基金会;
关键词
3-D integrated circuits (ICs); multicore design; network-on-chip (NoC) routing; on-chip networks; NETWORKS-ON-CHIP; DESIGN; ICS;
D O I
10.1109/TCAD.2017.2768415
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The vertical interlayer communication channel plays a critical role in defining the performance of a 3-D networkon-chip (NoC). In this paper, an arbitration-free design for the shared vertical channels is proposed. The proposed vertical arbitration-free 3-D NoC is compared with other 3-D NoC architectures using traditional synthetic traffic patterns and Rentian traffic emulating applications for chip multiprocessors. The results of the analysis show comparable performance in throughput, energy, and latency compared to a symmetric 3-D NoC with savings up to approximate to 20% in area. The proposed NoC is superior in performance to a 3-D NoC utilizing vertical arbitration with a similar area footprint.
引用
收藏
页码:1853 / 1866
页数:14
相关论文
共 50 条
  • [41] Numerical simulation of 3-D free shear layers
    Tsai, YP
    PARALLEL COMPUTATIONAL FLUID DYNAMICS: RECENT DEVELOPMENTS AND ADVANCES USING PARALLEL COMPUTERS, 1998, : 609 - 615
  • [42] Computing 3-D free surface viscoelastic flows
    Xie, X
    Pasquali, M
    MOVING BOUNDARIES VII: COMPUTATIONAL MODELLING OF FREE AND MOVING BOUNDARY PROBLEMS, 2004, 10 : 225 - 234
  • [43] It is 3-D imaging - No more imagining the era of 3-D CT urogram, 3-D angiogram, 3-D urethrogram
    Yachia, D
    Rub, R
    Jolkowski, E
    Karatas, B
    Erlich, N
    Soimu, U
    Bartal, G
    JOURNAL OF UROLOGY, 2004, 171 (04): : 510 - 510
  • [44] Design of Ternary Neural Network With 3-D Vertical RRAM Array
    Li, Zhiwei
    Chen, Pai-Yu
    Xu, Hui
    Yu, Shimeng
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (06) : 2721 - 2727
  • [46] A VERTICAL COORDINATE TRANSFORMATION FOR 3-D NUMERICAL MODELLING OF OCEAN CIRCULATION
    李鸿雁
    方国洪
    Chinese Journal of Oceanology and Limnology, 1995, (01) : 31 - 42
  • [47] Vertical RF Transition With Mechanical Fit for 3-D Heterogeneous Integration
    Chen, Lihan
    Wood, Joseph
    Raman, Sanjay
    Barker, N. Scott
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2012, 60 (03) : 647 - 654
  • [48] A Proposal of Vertical MOSFET and Electrothermal Analysis for Monolithic 3-D ICs
    Zhu, Jia-He
    Wang, Da-Wei
    Zhao, Wen-Sheng
    Dai, Jia-Yun
    Wang, Gaofeng
    ELECTRONICS, 2021, 10 (18)
  • [49] 3-D Vertical Dual-Layer Oxide Memristive Devices
    Gaba, Siddharth
    Sheridan, Patrick
    Du, Chao
    Lu, Wei
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (07) : 2581 - 2583
  • [50] Mitigating the Impact of Channel Tapering in Vertical Channel 3-D NAND
    Bhatt, Upendra Mohan
    Manhas, Sanjeev Kumar
    Kumar, Arvind
    Pakala, Mahendra
    Yieh, Ellie
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (03) : 929 - 936