Vertical Arbitration-Free 3-D NoCs

被引:1
|
作者
More, Ankit [1 ]
Pano, Vasil [2 ]
Taskin, Baris [2 ]
机构
[1] Intel Corp, Santa Clara, CA 95054 USA
[2] Drexel Univ, Elect & Comp Engn Dept, Philadelphia, PA 19104 USA
基金
美国国家科学基金会;
关键词
3-D integrated circuits (ICs); multicore design; network-on-chip (NoC) routing; on-chip networks; NETWORKS-ON-CHIP; DESIGN; ICS;
D O I
10.1109/TCAD.2017.2768415
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The vertical interlayer communication channel plays a critical role in defining the performance of a 3-D networkon-chip (NoC). In this paper, an arbitration-free design for the shared vertical channels is proposed. The proposed vertical arbitration-free 3-D NoC is compared with other 3-D NoC architectures using traditional synthetic traffic patterns and Rentian traffic emulating applications for chip multiprocessors. The results of the analysis show comparable performance in throughput, energy, and latency compared to a symmetric 3-D NoC with savings up to approximate to 20% in area. The proposed NoC is superior in performance to a 3-D NoC utilizing vertical arbitration with a similar area footprint.
引用
收藏
页码:1853 / 1866
页数:14
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