Vertical Arbitration-Free 3-D NoCs

被引:1
|
作者
More, Ankit [1 ]
Pano, Vasil [2 ]
Taskin, Baris [2 ]
机构
[1] Intel Corp, Santa Clara, CA 95054 USA
[2] Drexel Univ, Elect & Comp Engn Dept, Philadelphia, PA 19104 USA
基金
美国国家科学基金会;
关键词
3-D integrated circuits (ICs); multicore design; network-on-chip (NoC) routing; on-chip networks; NETWORKS-ON-CHIP; DESIGN; ICS;
D O I
10.1109/TCAD.2017.2768415
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The vertical interlayer communication channel plays a critical role in defining the performance of a 3-D networkon-chip (NoC). In this paper, an arbitration-free design for the shared vertical channels is proposed. The proposed vertical arbitration-free 3-D NoC is compared with other 3-D NoC architectures using traditional synthetic traffic patterns and Rentian traffic emulating applications for chip multiprocessors. The results of the analysis show comparable performance in throughput, energy, and latency compared to a symmetric 3-D NoC with savings up to approximate to 20% in area. The proposed NoC is superior in performance to a 3-D NoC utilizing vertical arbitration with a similar area footprint.
引用
收藏
页码:1853 / 1866
页数:14
相关论文
共 50 条
  • [1] Arbitration-free synchronization
    Leslie Lamport
    Distributed Computing, 2003, 16 : 219 - 237
  • [2] Arbitration-free synchronization
    Lamport, L
    DISTRIBUTED COMPUTING, 2003, 16 (2-3) : 219 - 237
  • [3] Sparse 3-D NoCs with Inductive Coupling
    Koibuchi, Michihiro
    Leong, Lambert
    Totoki, Tomohiro
    Niwa, Naoya
    Matsutani, Hiroki
    Amano, Hideharu
    Casanova, Henri
    PROCEEDINGS OF THE 2019 56TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2019,
  • [4] Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs
    Zhang, Hao
    Matsutani, Hiroki
    Take, Yasuhiro
    Kuroda, Tadahiro
    Amano, Hideharu
    IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS, 2013, E96D (12): : 2753 - 2764
  • [5] LDV measurements in a 3-D vertical, free convective enclosure
    Hsieh, SS
    HEAT TRANSFER SCIENCE AND TECHNOLOGY 1996, 1996, : 168 - 174
  • [6] Design and evaluation of an arbitration-free passive optical crossbar for on-chip interconnection networks
    Linjie Zhou
    Stevan S. Djordjevic
    Roberto Proietti
    Dan Ding
    S. J. B. Yoo
    Rajeevan Amirtharajah
    Venkatesh Akella
    Applied Physics A, 2009, 95 : 1111 - 1118
  • [7] Design and evaluation of an arbitration-free passive optical crossbar for on-chip interconnection networks
    Zhou, Linjie
    Djordjevic, Stevan S.
    Proietti, Roberto
    Ding, Dan
    Yoo, S. J. B.
    Amirtharajah, Rajeevan
    Akella, Venkatesh
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2009, 95 (04): : 1111 - 1118
  • [8] A Deadlock-Free Routing Algorithm Requiring No Virtual Channel on 3D-NoCs with Partial Vertical Connections
    Lee, Jinho
    Choi, Kiyoung
    2013 SEVENTH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS 2013), 2013,
  • [9] REDELF: An Energy-Efficient Deadlock-Free Routing for 3D NoCs with Partial Vertical Connections
    Lee, Jinho
    Kang, Kyungsu
    Choi, Kiyoung
    ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 2015, 12 (03)
  • [10] Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
    Matsutani, Hiroki
    Koibuchi, Michihiro
    Amano, Hideharu
    2007 INTERNATIONAL CONFERENCE ON PARALLEL PROCESSING WORKSHOPS (ICPP), 2007, : 620 - +