Investigation of Re-Program Scheme in Charge Trap-Based 3D NAND Flash Memory

被引:4
|
作者
Cheng, Ting [1 ,2 ,3 ]
Jia, Jianquan [1 ,2 ,3 ]
Jin, Lei [1 ,2 ,3 ]
Jia, Xinlei [1 ,2 ,3 ]
Xia, Shiyu [1 ,2 ,3 ]
Lu, Jianwei [3 ]
Li, Kaiwei [3 ]
Luo, Zhe [3 ]
Li, Da [3 ]
Liu, Hongtao [3 ]
Wang, Qiguang [3 ]
Zhang, An [3 ]
Yang, Daohong [3 ]
Huo, Zongliang [1 ,2 ,3 ]
机构
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Acad Microelect, Beijing 100049, Peoples R China
[3] Yangtze Memory Technol Co Ltd, Wuhan 430205, Peoples R China
关键词
3D NAND flash; QLC; re-program; IVS; LM; FAILURE MECHANISMS; LATERAL MIGRATION;
D O I
10.1109/JEDS.2021.3081635
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Early retention or initial threshold voltage shift (IVS) is one of the key reliability challenges in charge trapping memory (CTM) based 3D NAND flash. Re-program scheme was introduced in quad-level-cell (QLC) NAND (Shibata et al., 2007, Lee et al., 2018, Shibata et al., 2019, and Khakifirooz et al., 2021), and the IVS improvement by re-program scheme was reported. In this work, it is found that re-program can suppress similar to 81% of IVS in 3D NAND, which is much more significant than that of 2D NAND similar to 50% (Chen et al., 2010). The mechanisms of IVS improvement by re-program scheme in 3D NAND are investigated. Both vertical de-trapping in the BE-tunneling oxide and charge lateral migration (LM) in the charge-trap layer are suppressed in re-program. Re-program is effective in vertical de-trapping suppression both in checker-board pattern (C/P) and solid-board pattern (S/P) cases, and is effective in LM suppression only in C/P case. Furthermore, the LM improvement by re-program scheme is more pronounced with gate length (Lg) and inter-gate space (Ls) scaling down, showing potential in the reliability improvement of advanced 3D NAND technologies.
引用
收藏
页码:640 / 644
页数:5
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