Fabrication of patterned gold microstructure by selective electroless plating

Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit. (C) 2004 Elsevier B.V. All rights reserved.