Fabrication of patterned gold microstructure by selective electroless plating

被引：22
|
作者：
Guan, F
Chen, MA [1 ]
Yang, W
Wang, JQ
Yong, SR
Xue, QJ
机构：
[1] Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
[2] NW Normal Univ, Coll Chem & Chem Engn, Lanzhou 730070, Peoples R China
来源：
APPLIED SURFACE SCIENCE | 2005年 / 240卷 / 1-4期
关键词：
patterned metal microstructure; electroless plating; microcontact printing;
D O I：
10.1016/j.apsusc.2004.06.050
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码：24 / 27
页数：4
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