Accurate characterization of silicon-on-insulator MOSFETs for the design of low-voltage, low-power RF integrated circuits

被引:5
|
作者
Raskin, JP [1 ]
Gilon, R
Dambrine, G
Chen, J
Vanhoenacker, D
Colinge, JP
机构
[1] Univ Michigan, Radiat Lab, Ann Arbor, MI 48109 USA
[2] Alcatel Microelect, Oudenaande, Belgium
[3] Inst Electron & Microelectron Nord, Villeneuve Dascq, France
[4] Motorola Inc, Austin, TX USA
[5] Univ Catholique Louvain, Lab Hyperfrequences, B-1348 Louvain, Belgium
[6] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
关键词
integrated circuit measurements; microwave measurements; MOSFETs; scattering parameters measurements; silicon-on-insulator technology;
D O I
10.1023/A:1008380615900
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The maturation of low cost Silicon-on-Insulator (SOI) MOSFET technology in the microwave domain has brought about a need to develop specific characterization techniques. An original scheme is presented, which, by combining careful design of probing and calibration structures, rigorous in-situ calibration, and a new powerful direct extraction method, allows reliable identification of the parameters of the non-quasi-static small-signal model and the high-frequency noise parameters for MOSFETs. The extracted model is shown to be valid up to 40 GHz.
引用
收藏
页码:133 / 155
页数:23
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