Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors

被引：0
|
作者：
Honda, Yuki [1 ]
Goto, Masahide [1 ]
Watabe, Toshihisa [1 ]
Nanba, Masakazu [1 ]
Iguchi, Yoshinori [1 ]
Saraya, Takuya [2 ]
Kobayashi, Masaharu [2 ]
Higurashi, Eiji [2 ]
Toshiyoshi, Hiroshi [2 ]
Hiramoto, Toshiro [2 ]
机构：
[1] NHK Sci & Technol Res Labs, Setagaya Ku, 1-10-11 Kinuta, Tokyo 1578510, Japan
[2] Univ Tokyo, Meguro Ku, 4-6-1 Komaba, Tokyo 1538505, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
ELECTRODES;
D O I：
10.23919/ltb-3d.2019.8735257
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO2 bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.
引用
收藏
页码：45 / 45
页数：1
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