Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors

被引：0

作者：

Honda, Yuki ^{[1
]}

Goto, Masahide ^{[1
]}

Watabe, Toshihisa ^{[1
]}

Nanba, Masakazu ^{[1
]}

Iguchi, Yoshinori ^{[1
]}

Saraya, Takuya ^{[2
]}

Kobayashi, Masaharu ^{[2
]}

Higurashi, Eiji ^{[2
]}

Toshiyoshi, Hiroshi ^{[2
]}

Hiramoto, Toshiro ^{[2
]}

机构：

[1] NHK Sci & Technol Res Labs, Setagaya Ku, 1-10-11 Kinuta, Tokyo 1578510, Japan

[2] Univ Tokyo, Meguro Ku, 4-6-1 Komaba, Tokyo 1538505, Japan

来源：

PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年

关键词：

ELECTRODES;

D O I：

10.23919/ltb-3d.2019.8735257

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO2 bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.

引用

页码：45 / 45

页数：1

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