Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

被引：30

作者：

Ha, Sang-Su ^{[1
]}

Jang, Jin-Kyu ^{[1
]}

Ha, Sang-Ok ^{[1
]}

Yoon, Jeong-Won ^{[1
]}

Lee, Hoo-Jeong ^{[1
]}

Joo, Jin-Ho ^{[1
]}

Kim, Young-Ho ^{[2
]}

Jung, Seung-Boo ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea

[2] Hanyang Univ, Div Mat Sci & Engn, Seoul 133791, South Korea

来源：

MICROELECTRONIC ENGINEERING | 2010年 / 87卷 / 03期

关键词：

Flip chip; Sn-Ag; Intermetallic compound (IMC); Interfacial reaction; Shear test; METALLIZATION; RELIABILITY; SN-37PB; JOINTS;

D O I：

10.1016/j.mee.2009.07.015

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu6Sn5 IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu6Sn5 phase and a planar Cu3Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：517 / 521

页数：5

共 50 条

[41] Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package
MCNC, Research Triangle Park, United States
Proc Electron Compon Technol Conf, (1136-1142):
[42] Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints
Lee, HT
Chen, MH
Jao, HM
Hsu, CJ
JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (09) : 1048 - 1054
[43] Electromigration Characteristics of Flip Chip Sn-3.5Ag Solder Bumps under Highly Accelerated Conditions
Lee, Jang-Hee
Lim, Gi-Tae
Park, Young-Bae
Yang, Seung-Taek
Suh, Min-Suk
Chung, Qwan-Ho
Byun, Kwang-Yoo
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2009, 54 (05) : 1784 - 1792
[44] Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations
Jee, Young-Kun
Xia, Yang-Hua
Yu, Jin
Kang, Hyun-Woo
Lee, Taek-Young
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 491 - +
[45] Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
Y. D. Han
H. Y. Jing
S. M. L. Nai
L. Y. Xu
C. M. Tan
J. Wei
Journal of Electronic Materials, 2012, 41 : 2478 - 2486
[46] Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
Han, Y. D.
Jing, H. Y.
Nai, S. M. L.
Xu, L. Y.
Tan, C. M.
Wei, J.
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) : 2478 - 2486
[47] Effect of under bump metallization (UBM) on interfacial reaction and shear strength of electroplated pure tin solder bump
Kim, Yu-Na
Koo, Ja-Myeong
Park, Sun-Kyu
Jung, Seung-Boo
JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, 2008, 46 (01): : 33 - 38
[48] Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface
Nishikawa, Hiroshi
Komatsu, Akira
Takemoto, Tadashi
MATERIALS TRANSACTIONS, 2008, 49 (07) : 1518 - 1523
[49] Interfacial reaction and shear properties of lead-free Sn3.5Ag solder bumps reflowed by induction self heating
Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, China
不详
Nami Jishu yu Jingmi Gongcheng, 2007, 3 (157-163):
[50] Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer
Seung-Hyun Lee
Hee-Ra Roh
Zhi Gang Chen
Young-Ho Kim
Journal of Electronic Materials, 2005, 34 : 1446 - 1454

← 1 2 3 4 5 →