Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

被引：30
|
作者：
Ha, Sang-Su [1 ]
Jang, Jin-Kyu [1 ]
Ha, Sang-Ok [1 ]
Yoon, Jeong-Won [1 ]
Lee, Hoo-Jeong [1 ]
Joo, Jin-Ho [1 ]
Kim, Young-Ho [2 ]
Jung, Seung-Boo [1 ]
机构：
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea
[2] Hanyang Univ, Div Mat Sci & Engn, Seoul 133791, South Korea
来源：
MICROELECTRONIC ENGINEERING | 2010年 / 87卷 / 03期
关键词：
Flip chip; Sn-Ag; Intermetallic compound (IMC); Interfacial reaction; Shear test; METALLIZATION; RELIABILITY; SN-37PB; JOINTS;
D O I：
10.1016/j.mee.2009.07.015
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu6Sn5 IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu6Sn5 phase and a planar Cu3Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：517 / 521
页数：5
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