Study of Process Window Discovery Methodology for 28nm and Beyond Technology Node Process Window Limiting Structures

被引:1
|
作者
Zhang, Xingdi [1 ]
Chen, Hunglin [1 ]
Long, Yin [1 ]
Wang, Kai [1 ]
机构
[1] Shanghai Huali Integrated Circuit Corp, Shanghai 201314, Peoples R China
关键词
Process window qualification (PWQ); Process window discovery (PWD); Optical proximity correction (OPC); process window limiting structures ( PWLS); defect detection methodology; Nano-point function; defect monitor; yield enhancement;
D O I
10.1109/asmc49169.2020.9185267
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Process window limiting structures (PWLS) evaluated with process window discovery methodology (PWD) was studied on 28nm and beyond technology node wafers. Process window discovery methodology was innovated basing on process window qualification (PWQ) methodology. And the impacted factors, including focus energy matrix (FEM) wafer conditions, defects inspection conditions and defects filtering and sampling methods, were also investigated. With the innovated methodology, process window limiting structures were detected on 28nm wafers. Then the more reasonable process window target and spec, including lithography and etch process, were redefined. Furthermore, the process window limiting structures were enhanced monitored with Nano-point function of bright-field inspection system. Instead of end of line (EoL) chip probe (CP) test, inline process window discovery methodology has much time advantage for process window evaluation and process window limiting structures definition even monitoring.
引用
收藏
页数:8
相关论文
共 50 条
  • [1] THE STUDY AND INVESTIGATION OF INLINE E-BEAM INSPECTION FOR 28NM PROCESS WINDOW MONITOR
    Long, Yin
    Yuan, Zengyi
    Pan, Fengjia
    Wang, Kai
    Chen, Hunglin
    2020 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2020 (CSTIC 2020), 2020,
  • [2] Process Window Optimizer for pattern based defect prediction on 28nm Metal Layer
    Fanton, P.
    La Greca, R.
    Jain, V.
    Prentice, C.
    Simiz, J-G.
    Hunsche, S.
    Le-Gratiet, B.
    Depre, L.
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXX, 2016, 9778
  • [3] The Study of 28nm Node Poly Double Patterning Integrated Process
    Li, Zhonghua
    Li, Runling
    Guan, Tianpeng
    Liu, Biqiu
    Mao, Xiaoming
    Meng, Xiangguo
    Li, Quanbo
    Li, Fang
    Yang, Zhengkai
    Zhang, Yu
    Pang, Albert
    2015 China Semiconductor Technology International Conference, 2015,
  • [4] OPC accuracy and process window verification methodology for sub-100nm node
    Yang, HJ
    Park, C
    Hong, JY
    Jeong, GM
    Cho, BH
    Choi, JS
    Kang, CS
    Yang, KH
    Kang, ES
    Ji, SH
    Yim, D
    Song, YW
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVIII, PTS 1 AND 2, 2004, 5375 : 437 - 443
  • [5] Methodology for Robust Process Window Discovery in Plasmonic Nanostructures
    Annamalaiai, Muthiah
    Rathi, Somilkumar J.
    PLASMONICS: DESIGN, MATERIALS, FABRICATION, CHARACTERIZATION, AND APPLICATIONS XXII, 2024, 13111
  • [6] Process Window Discovery Methodology Development for Advanced Lithography
    Van den Heuvel, Dieter
    Foubert, Philippe
    Baudemprez, Bart
    Lee, Angelica
    Cross, Andrew
    Sah, Kaushik
    Haque, Naoshin
    Parisi, Paolo
    Baris, Oksen
    2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2016, : 65 - 71
  • [7] Resist 3D model based OPC for 28nm metal process window enlargement
    Fanton, P.
    Le Denmat, J. C.
    Gardiola, C.
    Pelletier, A.
    Foussadier, F.
    Gardin, C.
    Planchot, J.
    Szucs, A.
    Ndiaye, O.
    Martin, N.
    Depre, L.
    Robert, F.
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXX, 2016, 9778
  • [8] A Complete Process Design Kit Verification Flow and Platform for 28nm Technology and Beyond
    Li, Yanfeng
    Li, Miao
    Wong, Waisum
    2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012), 2012, : 1619 - 1622
  • [9] 28nm Node Process Optimization: A Lithography Centric View
    Seltmann, Rolf
    30TH EUROPEAN MASK AND LITHOGRAPHY CONFERENCE, 2014, 9231
  • [10] Research of SMO process to improve the imaging capability of lithography system for 28nm node and beyond
    Yu, Haibin
    Zhang, Yueyu
    Jiang, Binjie
    Yu, Shirui
    Mao, Zhibiao
    2017 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC 2017), 2017,