共 50 条
- [41] Packaging Trends in Mobile Electronics - Towards Wafer Level Packaging PROCEEDINGS OF THE 2010 34TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT 2010), 2011,
- [42] University education program on microelectronics packaging and assembly: Facing the challenging of fast developing electronics industry ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 546 - +
- [43] AN OPTIMIZED POWER ELECTRONICS PACKAGING CONCEPT PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 686 - 696
- [44] Paperonics - printed Electronics for smart Packaging WOCHENBLATT FUR PAPIERFABRIKATION, 2021, 149 (11): : 12 - 14
- [45] Securing the reliability of power electronics packaging ETG-Fachberichte (Energietechnische Gesellschaft im VDE), 2000, (81): : 125 - 133
- [47] How to teach electronics packaging technology? 24TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: CONCURRENT ENGINEERING IN ELECTRONIC PACKAGING, CONFERENCE PROCEEDINGS, 2001, : 7 - 12
- [48] Al/SiC for power electronics packaging 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 162 - 165
- [49] Advanced packaging technologies for automotive electronics ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 59 - +
- [50] Humidity control simulation for electronics packaging ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 2, 2003, : 767 - 777