Networking the electronics packaging education

被引：2

作者：

Illyefalvi-Vitéz, Z ^{[1
]}

Golonka, L ^{[1
]}

Mach, P ^{[1
]}

Nicolics, J ^{[1
]}

Svasta, P ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, H-1111 Budapest, Hungary

来源：

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/ECTC.2000.853291

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The development of information technology has opened new perspectives in spreading scientific information and in education as well. Studying the curricula of other universities, paying virtual visits to laboratories and departments, taking courses, training and examinations using the Internet became a reality by now and hopefully will be everyday practice in the future. In the field of electronics packaging education it is essential to use all these tools provided by information technology, in order to prepare engineers for the needs of the 21(st) century. A microelectronics packaging education network was established for the virtual integration of the activity of university departments in the Central European region, having already contact with each other in the form of the traditional International Spring Seminars on Electronics Technology.

引用

页码：1008 / 1015

页数：2

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