Fabrication of Diamond/Cu Direct Bonding for Power Device Application

被引：0
|
作者：
Kanda, Shinji [1 ]
Masuya, Satoshi [2 ]
Kasu, Makoto [2 ]
Shigekawa, Naoteru [1 ]
Liang, Jianbo [1 ]
机构：
[1] Osaka City Univ, Grad Sch Engn, Sumiyoshi Ku, 3-3-138 Sugimoto, Osaka 5588585, Japan
[2] Saga Univ, Dept Elect & Elect Engn, 1 Honjo Machi, Saga 8408502, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
D O I：
10.23919/ltb-3d.2019.8735136
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Direct bonding of diamond and Cu is successfully fabricated by surface activated bonding method. An almost full contact area of diamond and Cu is obtained. The effect of annealing temperature on the structure properties of the bonding interface is investigated under in-situ annealing in a transmission electron microscope (TEM).
引用
收藏
页码：57 / 57
页数：1
相关论文
共 50 条
  • [31] Direct Bonding of GaN to Diamond Substrate at Room Temperature
    Suga, Tadatomo
    Mu, Fengwen
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1328 - 1331
  • [32] Room-temperature direct bonding of diamond and Al
    Liang, Jianbo
    Yamajo, Shoji
    Kuball, Martin
    Shigekawa, Naoteru
    SCRIPTA MATERIALIA, 2019, 159 : 58 - 61
  • [33] Strapped Cu interconnect for enhancing electromigration limit for power device application
    Park, Young-Joon
    Joh, Jungwoo
    Chung, Jayhoon
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 368 - 371
  • [34] IMPORTANCE OF BONDING TO DIAMOND SURFACES IN INDUSTRIAL APPLICATION
    RAAL, FA
    INDUSTRIAL DIAMOND REVIEW, 1968, 28 (336): : 495 - &
  • [35] SYNTHESIS AND DEVICE FABRICATION OF CU-NI NANOCOMPOSITE FOR LOW POWER MAGNETIC MICROACTUATION
    Huang, Yu Wen
    Chao, Tzu-Yuan
    Cheng, Y. T.
    2007 7TH IEEE CONFERENCE ON NANOTECHNOLOGY, VOL 1-3, 2007, : 903 - 906
  • [36] New etching process for device fabrication using diamond
    Hwang, DS
    Saito, T
    Fujimori, N
    DIAMOND AND RELATED MATERIALS, 2004, 13 (11-12) : 2207 - 2210
  • [37] Fabrication and performance of a thin CVD diamond plate bonding tool
    Watanabe, Junichi
    Ohtake, Naoto
    Yoshikawa, Masanori
    Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 1992, 58 (05): : 797 - 802
  • [38] Local oxidation of hydrogenated diamond surfaces for device fabrication
    Rezek, B
    Garrido, JA
    Stutzmann, M
    Nebel, CE
    Snidero, E
    Bergonzo, P
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 2002, 193 (03): : 523 - 528
  • [39] Fabrication of AlN/Cu composite structure via laser surface metallization assisted direct bonding technology
    Liu, Duo
    Chen, Naibin
    Song, Yanyu
    Wang, Ningning
    Zhu, Haitao
    Fei, Jingming
    An, Qi
    Tan, Caiwang
    Song, Xiaoguo
    JOURNAL OF MANUFACTURING PROCESSES, 2024, 119 : 640 - 648
  • [40] Microfluidic device fabrication mediated by surface chemical bonding
    Sivakumar, Rajamanickam
    Lee, Nae Yoon
    ANALYST, 2020, 145 (12) : 4096 - 4110
12345