The impact of gate-to-source tunneling current on the characterization of metal-oxide-semiconductor field-effect transistor's hot-carrier reliability

被引:0
|
作者
Chen, JF [1 ]
Tsao, CP
Ong, TC
机构
[1] Natl Cheng Kung Univ, Dept Elect Engn, Tainan 701, Taiwan
[2] Natl Cheng Kung Univ, Inst Microelect, Tainan 701, Taiwan
[3] Taiwan Semicond Mfg Co, Hsinchu, Taiwan
关键词
MOSFET hot-carrier; reliability; tunneling current; ultra-thin gate oxide;
D O I
10.1143/JJAP.42.2149
中图分类号
O59 [应用物理学];
学科分类号
摘要
Drain current (I-d) degradation due to Fowler-Nordheim (FN) stress and V-g = V-d stress were investigated in 0.15mum n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs) and p-channel metal-oxide-semiconductor field-effect transistors (pMOSFETs). When pMOSFETs reach the lifetime under V-g = V-d stress, the damage resulting from gate-to-source tunneling current is not negligible in comparison with the damage caused by channel hot carriers. Id degradation models of pMOSFETs under FN stress and V-g = V-d stress were established. According to the I-d degradation models, the impact of gate-to-source tunneling current on the result of hot-carrier reliability testing is discussed.
引用
收藏
页码:2149 / 2151
页数:3
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